-
Introduction To FODM452R2Source: Release Date:2026/7/17 Click On:110
Ⅰ.Overview of FODM452R2FODM452R2 is a single-channel transistor output optoisolator manufactured by onsemi, featuring reliable optical isolation and high-speed signal transmission performance. It is widely adopted in ind...
Details -
Introduction To PE42820MLBA-XSource: Release Date:2026/7/6 Click On:2
Ⅰ.Overview of PE42820MLBA-X It is a reflective SPDT RF switch launched by pSemi adopting UltraCMOS® and HaRP™ technologies. This active surface-mount component covers 30MHz–2.7GHz for general wireless RF signal switching...
Details -
Introduction To TJA1051T/3.118Source: Release Date:2026/7/3 Click On:2
Ⅰ.Overview of TJA1051T/3.118The TJA1051T/3.118 is a high-performance CAN bus transceiver developed by NXP. It serves as an interface to realize half-duplex differential signal transmission and reception for CAN bus commu...
Details -
Introduction To SP3223EUEY-L/TRSource: Release Date:2026/7/2 Click On:1
Ⅰ.Overview of SP3223EUEY-L/TRThis is a 2-transceiver RS232 interface IC manufactured by MaxLinear for full-duplex serial communication. It supports wide single-supply voltage and automatic power-saving control for embedd...
Details -
Introduction To W972GG6KB-18Source: Release Date:2026/6/24 Click On:3
Ⅰ.Overview of W972GG6KB-18W972GG6KB-18 is a 2Gbit parallel DDR2 SDRAM volatile memory chip developed and produced by Winbond Electronics. It balances transmission speed, storage capacity and power consumption to serve ma...
Details -
Introduction Tots3usb221drcrSource: Release Date:2026/6/23 Click On:2
Ⅰ.Overview of TS3USB221DRCRThe TS3USB221DRCR is a dedicated special-purpose analog switch developed by Texas Instruments for high-speed USB signal switching. It supports USB 2.0 high-speed transmission and features stabl...
Details -
Introduction To SI3552DV-T1-E3Source: Release Date:2026/6/17 Click On:2
Ⅰ.Overview of SI3552DV-T1-E3SI3552DV-T1-E3 is a dual complementary N and P-channel MOSFET array manufactured by Vishay Siliconix. Adopting advanced TrenchFET® technology, it features compact size and excellent electrical...
Details -
Introduction To PSMN1R9-80SSEJSource: Release Date:2026/6/9 Click On:2
Ⅰ.Overview of PSMN1R9-80SSEJPSMN1R9-80SSEJ is a single N-channel MOSFET manufactured by Nexperia USA Inc., belonging to discrete semiconductor transistor products. It features low on-resistance and high power endurance,...
Details -
Introduction To LSDND4040JET100MMSource: Release Date:2026/5/19 Click On:1
Ⅰ.Overview of LSDND4040JET100MMThis is a compact surface-mount isolated DC-DC converter launched by Analog Devices. It delivers stable isolated power and suits various compact circuit power supply designs.Ⅱ.LSDND4040JET1...
Details -
Introduction To TS5USBC402IYFPRSource: Release Date:2026/5/18 Click On:2
Ⅰ.Overview of TS5USBC402IYFPRTS5USBC402IYFPR is a special-purpose analog switch integrated circuit developed by Texas Instruments for USB 2.0 signal switching scenarios. It integrates reliable overvoltage protection and...
Details
Popular Industry Information
- 1 5G Business Is Expected To Continue To Drive South Korea Exports
- 2 Amd And Nvidia Fail By Quantity Pricing Strategy Gpu Price Rise Is Still Hard To Stop
- 3 Zikuo Shares Combined Acquisition And Holdings Purple Transport Cloud Perfect Cloud Computing Industry Chain
- 4 New All-optical Diode Can Be Used In Miniature Optical Circuits
- 5 Global Crystal: Acquisition Of The World's Lowest Price Drop 15% Of The Acquisition Time Is Extended To February 10
- 6 Stmicroelectronics Announced The Initial Revenue In The Fourth Quarter Of 2020
- 7 Intel Needs To Expand Wafer To Strengthen Dram Advantage If It Wants To Get Back To First Place
- 8 This Year's First Quarter Of The Station, 5 Nanometers, Or Still Maintains High-End
- 9 Resistance Rises Again: Tdk Capacitor Rises 3-4 Times
- 10 Toshiba's $18 Billion Chip Sale Could Not Be Completed On Time: Or Consider Ipo
- Hot Keywords:
- All high-performance semiconductor Intel high-speed automotive-grade transmission high-density high-precision reliable reliability compatibility battery-powered space-constrained Samsung fluctuation high-frequency high-reliability low-power capacitance industrial automotive AMD stability highly integrated assembly TSMC efficiency high reliability chip versatile cost-effective Qualcomm electromagnetic adaptability stable Semiconductor miniaturization microcontroller high-efficiency sensor effectively portable attenuation efficient 5G amplification module industrial control conversion transient