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The LCMXO3LF-6900C-6BG400C is a high-performance Field Programmable Gate Array (FPGA) belonging to Lattice Semiconductor’s MachXO3 series. It is designed for embedded applications, offering a balance of flexibility, low power consumption, and compact packaging, making it suitable for a wide range of industrial and consumer electronics scenarios.
Category:Integrated Circuits (ICs),Embedded,FPGAs (Field Programmable Gate Array)
Mfr:Lattice Semiconductor Corporation
Series:MachXO3
Packaging:Tray
Part Status:Active
Number of I/O:335
Voltage - Supply:2.375V ~ 3.465V
Mounting Type:Surface Mount
Operating Temperature:0°C ~ 85°C (TJ)
Package / Case:400-LFBGA
Supplier Device Package:400-CABGA (17x17)
High I/O Density:With 335 I/O pins, the device supports versatile connectivity, enabling integration with multiple external components (e.g., sensors, memory modules, and microcontrollers) in complex embedded systems.
Wide Supply Voltage Range:The 2.375V ~ 3.465V supply voltage tolerance enhances compatibility with various power management designs, reducing the need for additional voltage regulation components.
Industrial-Grade Temperature Operation:Operating within 0°C ~ 85°C (TJ) makes it suitable for industrial environments where temperature fluctuations are common, ensuring stable performance in harsh conditions.
Compact Surface-Mount Packaging:The 400-LFBGA/CABGA (17x17mm) package minimizes board space usage, which is critical for miniaturized electronic devices such as portable industrial controllers or consumer IoT products.
Active Part Status: As an active component, it guarantees long-term availability for production, supporting consistent supply chains for both prototyping and mass manufacturing.
Low Power Consumption:Optimized for low power (a key feature of the MachXO3 series), it extends battery life in portable applications and reduces energy costs in stationary systems.
The LCMXO3LF-6900C-6BG400C FPGA from Lattice Semiconductor’s MachXO3 series stands out as a versatile, reliable solution for embedded applications. Its combination of high I/O density, wide voltage compatibility, industrial-grade temperature operation, and compact packaging addresses the core needs of modern electronic design—from space-constrained consumer devices to harsh industrial systems.
Industry Information