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The MR4A16BMA35 is an advanced magnetoresistive RAM (MRAM) integrated circuit developed by Everspin Technologies Inc. As a high-performance memory solution, it combines the advantages of non-volatility, fast access speed, and parallel interface functionality, making it a reliable choice for a variety of memory-intensive applications.
Category:Integrated Circuits (ICs),Memory
Mfr:Everspin Technologies Inc.
Packaging:Tray
Part Status:Active
Memory Format:RAM
Technology:MRAM (Magnetoresistive RAM)
Memory Size:16Mbit
Memory Organization:1M x 16
Memory Interface:Parallel
Write Cycle Time - Word, Page:35ns
Voltage - Supply:3V ~ 3.6V
Operating Temperature:0°C ~ 70°C (TA)
Mounting Type:Surface Mount
Package / Case:48-LFBGA
MRAM Technology Advantage:Adopts magnetoresistive RAM technology, which offers non-volatile storage—retaining data even when power is disconnected—eliminating the need for backup power sources compared to volatile RAM like DRAM.
Optimal Memory Configuration:Features a 16Mbit memory size organized as 1M x 16, providing sufficient storage capacity while supporting 16-bit data width for efficient parallel data transfer.
Fast Write Performance:Boasts a short write cycle time of 35ns, enabling rapid data storage and update operations, suitable for applications requiring high-speed data throughput.
Parallel Interface:Equipped with a parallel interface that facilitates direct and efficient connection to microcontrollers, processors, and other digital systems, simplifying hardware integration.
Stable Power Supply:Operates within a 3V ~ 3.6V voltage range, compatible with common power supply designs in digital electronics, ensuring consistent performance.
Surface Mount Packaging:Utilizes a 48-LFBGA surface mount package, which saves PCB space, supports automated assembly processes, and enhances mechanical robustness.
The MR4A16BMA35 from Everspin Technologies Inc. emerges as a versatile and high-performance memory solution, leveraging MRAM technology to deliver non-volatility, fast write cycles, and reliable operation. With its optimized memory configuration, parallel interface, and compact packaging, it is well-adapted to meet the demands of industrial, automotive, consumer, and embedded applications, solidifying its position as a valuable component in modern digital systems.
Industry Information