Home > Industry Information > 808-AG11D-ESL-LF
The 808-AG11D-ESL-LF is an 8-pin Dual In-line Package (DIP) IC socket with a standard 2.54mm (0.1-inch) pin pitch, conforming to the 0.3-inch row spacing DIP standard. Its design allows integrated circuits to be installed, tested, or replaced without direct soldering to the PCB, significantly enhancing flexibility and efficiency in prototyping, production testing, and field maintenance.
Category:Connectors, Interconnects;Sockets for ICs, Transistors;IC Sockets
Manufacturer:TE Connectivity AMP Connectors
Series:800
Packaging:Tube
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:Flash
Contact Material - Post:Copper
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:-55°C ~ 105°C
Termination Post Length:0.125" (3.18mm)
Material Flammability Rating:UL94 V-0
Contact Resistance:10mOhm
Base Product Number:808
High-Reliability Connection: Beryllium copper contacts with gold plating ensure low contact resistance (10mΩ) and stable electrical performance, suitable for precise signal transmission.
Excellent Mechanical Performance: The open-frame design facilitates chip insertion/extraction while providing good chip visibility and heat dissipation.
Wide Temperature Range & High Durability: Supports an extreme temperature range of -55°C to 105°C. Housing material is rated UL94 V-0 for flame retardancy, meeting demanding environmental requirements.
Standard Compliance: Fully compatible with standard 0.3-inch DIP packaged integrated circuits, facilitating replacements and upgrades.
Ease of Production & Maintenance: Through-hole soldering provides robust mechanical fixation, simplifies PCB assembly, and allows for in-field chip replacement.
Development Boards & Prototyping: Used on microcontroller (e.g., PIC, AVR, 8051) development boards and evaluation boards for convenient chip programming and testing.
Automated Test Equipment (ATE): Serves as part of IC test sockets for production testing or quality inspection.
Industrial Control Modules: Used in PLC modules, communication interface boards, and other industrial equipment requiring high-reliability connections or chip serviceability.
Military & High-Reliability Electronics: Suitable for aerospace, defense, and other high-demand fields due to its wide temperature range and rugged design.
Education & Experiment Kits: Protects expensive ICs from thermal stress damage caused by repeated soldering in electronics teaching labs.
The 808-AG11D-ESL-LF is a well-designed and reliable standard DIP IC socket. Its gold-plated contacts, wide operating temperature capability, and robust flame-retardant construction make it an ideal interconnect solution for a wide range of applications, from prototyping to high-reliability industrial systems. It not only provides superior electrical connection but also significantly enhances design flexibility, testability, and maintainability of electronic equipment.
Industry Information
