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The 2013022-1 is a surface-mount 204-position DDR3 SODIMM memory socket connector manufactured by TE Connectivity AMP Connectors. This connector adheres to the standard SODIMM form factor and is specifically designed to interface with DDR3 SDRAM memory modules. Its key features include a gold contact finish for reliable electrical connection and integrated board guides and latches for precise module insertion and secure locking. It is widely used in various embedded systems, industrial computers, networking/communication equipment, and consumer electronics that require onboard or expandable memory.
Category:Connectors, Interconnects;Memory Connectors;Inline Module Sockets
Manufacturer:TE Connectivity AMP Connectors
Packaging:Tray
Part Status:Active
Connector Style:SODIMM
Number of Positions:204
Memory Type:DDR3 SDRAM
Mounting Type:Surface Mount
Features:Board Guide, Latches
Mounting Feature:Normal, Standard - Top
Card Thickness:0.050" (1.27mm)
Color:Black
Contact Finish:Gold
Contact Finish Thickness:Flash
Base Product Number:2013022
Standard Compliance: Fully compliant with the industrial standard for 204-pin DDR3 SODIMM, ensuring mechanical and electrical compatibility with commercially available standard DDR3 SODIMM memory modules.
High-Reliability Connection: The gold-plated contacts (even as flash plating) effectively resist oxidation, reduce contact resistance, and ensure signal integrity for high-speed data transfer and long-term connection stability.
User-Friendly Mechanical Design: Integrated board guides assist in easy alignment of the memory module, preventing misinsertion. The side latches ensure the module remains firmly seated in environments with vibration or movement.
Robust SMT Construction: Designed for surface-mount technology, it provides strong PCB solder joint integrity capable of withstanding the mechanical stress from repeated module insertion and extraction.
Industrial-Grade Quality: Manufactured by TE Connectivity, a globally recognized leader in connectivity solutions, the product undergoes rigorous testing to meet the reliability and durability demands of industrial applications.
Space-Efficient: The SODIMM form factor is compact, saving significant motherboard space compared to traditional DIMM sockets, making it suitable for space-constrained embedded designs.
Embedded Systems & Single-Board Computers: Expandable memory interface for industrial control boards, IoT gateways, digital signage players.
Networking & Communication Equipment: Memory module connection in routers, switches, firewalls, and NAS devices for hosting operating systems and cache.
Industrial PCs & Servers: Suitable for industrial control computers and low-power server nodes where high reliability is paramount.
Test & Measurement Equipment: Instruments requiring flexible memory configuration to run different software or process data sets.
Consumer Electronics: High-end mini PCs, all-in-one computers, and specially designed gaming hardware.
The 2013022-1 is a high-quality DDR3 SODIMM memory socket connector based on a mature industry standard. Its value lies in providing reliable electrical connection, convenient and secure mechanical latching, and broad compatibility with standard components. For engineers designing any embedded or compact system based on DDR3 SODIMM memory architecture, choosing this connector translates to reduced supply chain risk and assured long-term stability of the memory subsystem. The brand reputation of TE Connectivity strongly endorses its performance and reliability.
Industry Information
